Guest Speaker

Towards Sustainability: State of the Art in Simulations of Blow Molding, Packaging Design, and Virtual Testing

Wednesday, September 10, 2025

10:30 a.m. to 11:00 a.m.

(see full conference schedule)

Presentation Description:

The Packaging solution will showcase Ansys' innovative solutions tailored for the packaging industry. With over 50 years of simulation innovation and leadership, Ansys continues to invest in critical simulation capabilities, strategic partnerships, and organic software development. This presentation highlights the unique design of Ansys' product portfolio, platform, and ecosystem, which optimizes product development systems and addresses various packaging challenges.

Key topics covered will include physics-based 3D simulation, digital engineering revolution, packaging concerns, and trends in packaging materials. Ansys' tools and solutions for package design, manufacturing, filling, and processing will be discussed, along with material selection and testing. The presentation will also delve into specific use-cases such as pouch filling, flow wrap process simulation, and liquid filling challenges. The importance of virtual testing, material distribution optimization, and early-stage simulation to reduce risks and enhance design efficiency will be discussed.

Overall, this presentation will demonstrate how Ansys' engineering simulation technology helps design products that efficiently survive specific operating conditions and loads, improve product performance and reliability, and accelerate time to market.

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